Electronic & Photonic Packaging Division
Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering.
News & Updates
Call for Papers - JEP Special Issue
Special Issue – InterPACK 2024 of ASME Journal of Electronic Packaging
InterPACK is a premier international forum for exchanging state-of-the-art knowledge in research, development, manufacturing, and electronic packaging applications and heterogeneous integration. It is also the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The Journal of Electronic Packaging (JEP) publishes papers that use experimental and theoretical methods, approaches, and techniques to address and solve various mechanical, materials, thermal, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
Authors are invited to submit their manuscripts revised from their original conference papers to be considered for the Special Issue.
Learn more from the Call for Papers Flyer
EPPD Collaborating with MIPE and ISPS
The Executive Committee of the Electronic and Photonic Packaging Division (EPPD) recently met with leaders from the Japan Society of Mechanical Engineers’ (JSME) Information, Intelligence and Precision Equipment (IIP) Division regarding a collaboration between our two organizations beginning at the ASME InterPACK 2025 conference.
Learn all about this collaboration
About
Leadership
To contact any of these leaders, use the ASME Volunteer Leader Directory (VLD).
Sreekant Narumanchi
Chair | July 2024 – June 2025
Jin Yang
Vice Chair | July 2024 – June 2025
Ankur Jain
Treasurer | July 2024 - June 2025
Przemslaw Gromala
Secretary | July 2024 - June 2025
Damena Agonafer
Member-at-Large | July 2024 – June 2025
Barbara Zlatnik
Staff Contact
Events
Featured Event
InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Holiday Inn San Jose - Silicon Valley
San Jose, CA
October 8–10, 2024
Past Events
InterPACK® International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic MicrosystemsSan Diego Mission Valley, San Diego, CA, October 24–26, 2023
Interpack 2022 - International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
Anaheim, CA, October 25 - 27, 2022
InterPACK 2021
Virtual, Online
October 26 - 28 2021
InterPACK® 2020
Virtual, Online
October 27 - 29, 2020
InterPACK® 2019
Hilton Anaheim, Anaheim, CA,
October 7 - 9, 2019
Honors & Awards
Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.
Society Awards:
Division Awards:
- Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation. - Mechanics Award
For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling. - Women In Engineering Award
To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. - Young Engineer Award
To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. - Student Member of the Year Award
To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging. - K-16 Clock Award
(Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics
Nominations link for processing division awards
Links
Links to helpful online resources related to the division are below. If you have suggestions for other resources, please contact the division chair or ASME staff.
Other Links of Interest
- ASME Landmarks Program
Landmarks, sites and collections of historic importance to mechanical engineering are designated by ASME through its History and Heritage Landmarks Program. - SEMI: Semiconductor Equipment and Materials International
- IMAPS - International Microelectronics And Packaging Society
- IEEE Components, Packaging, & Manufacturing Technology Society
- Society for Experimental Mechanics, Inc.
- NSF Engineering
- Optoelectronics, Microelectronics, Information Technology - Data Storage Systems Center, Carnegie Mellon University
- Integrated Media Systems Center, University of Southern California
- Laser Focus World Online
- Photonics Online
- Optics.org: Photonics Resources for Scientists & Engineers
- Printed Wiring Board (PWB) Resource Center
- SMT NET (Surface Mount Technology Network)
- The Cork Electronics Industry Association (Ireland)
- Armed Forces Communications & Electronics Association
- Electronics Manufacturers Association
- The Semiconductor Subway